ENGINEERING OVERVIEW
Heat transfer and dielectric use
IM1 and IM7 can support direct and immersion cooling, semiconductor thermal management and dielectric-testing applications, subject to equipment and materials review.
Grade selection
IM1 and IM7 differ in boiling point and environmental profile. A similar boiling point may support a cross-match discussion, but does not by itself establish drop-in compatibility.
Technical approval
Polytroniks can coordinate current product documentation, evaluation quantity and quotation support for qualified applications.
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